演講摘要：

精密微細、低損低熱、三維選擇，這些獨一無二的優(yōu)勢，使得超快激光微加工在消費電子、半導體、生物醫(yī)療、航空航天等產業(yè)日益得到應用。在上述應用領域，超快激光微加工面臨著如何進一步提高加工質量、提高加工效率、擴大應用范圍等挑戰(zhàn)。本報告主要介紹超快激光精密加工技術在上述領域的應用案例、工藝特點以及未來發(fā)展。 With the unique advantages of precision, less material loss, low heat input and three-dimensional selection, ultrafast laser micromachining has been applied in consumer electronics, semiconductor, biomedical, aerospace and other industries. In the above application fields, ultrafast laser micromachining is facing the challenges of how to further improve the quality of processing, improve the efficiency of processing and expand the application range. This report mainly introduces the application cases, process characteristics and future trends of ultrafast laser micromachining in the above fields.